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Thermal Engineer, Mission Electronics

Anduril· Hardware Platform : Hardware Engineering Services
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Costa Mesa, CA$129k - $171kFull-timePosted 3w ago

About the role

Thermal Engineer role focusing on thermal design of electronic assemblies across air, maritime, ground systems, and wearables. Owns thermal architecture, analysis, testing, and cross-functional collaboration to ensure reliability in demanding environments.

Responsibilities

  • Own the thermal design and analysis of electronics—from board and component level up through enclosures and full assemblies—for products across air vehicles, maritime and ground systems, and wearables/body-worn devices.
  • Use first principles to guide decisions, executing hand calculations, spreadsheets, and MATLAB/Python first-order models before detailed design.
  • Define thermal architecture and heat-rejection paths (conduction, natural and forced convection, cold plates, heat sinks, heat pipes, TIMs, coatings) to keep components within limits across environments.
  • Establish operating conditions for each platform based on standards and use cases (altitude, flight envelopes, salt fog, humidity, solar load, human-contact limits).
  • Characterize and document component power dissipation with electrical/other engineers.
  • Communicate trade-offs of architectures with respect to thermal considerations and balance margin against size, weight, and power.
  • Own thermal FEA/CFD models and define design limits for test/operation.
  • Define and execute prototype builds and tests to verify thermal designs (CAD, sensors/DAQ, data post-processing).
  • Present thermal status at reviews with timelines and status updates.
  • Develop internal tools to improve analysis efficiency.
  • Support failure reviews and root-cause analysis with test data and thermal analysis.

Qualifications

  • MS or higher in mechanical engineering, aerospace engineering, applied physics, or related field with focus on heat transfer and fluid dynamics (BS with additional experience considered)
  • In-depth understanding of heat transfer and fluid dynamics fundamentals
  • 2-4 years of experience in thermal design, analysis, or testing for electronics or integrated hardware products (graduate research counts)
  • Familiarity with electronics cooling concepts (TIMs, heat sinks, heat pipes, cold plates, enclosure rejection)
  • Exposure to thermal testing (sensor selection, data acquisition, data post-processing)
  • Experience with at least one thermal FEA/CFD tool (STAR-CCM+, ANSYS, Icepak, FloEFD, COMSOL)
  • CAD experience with Siemens NX, SolidWorks, or equivalent
  • U.S. Top Secret security clearance eligibility
  • Passion for defending the United States and allies

Skills

Required:Thermal design & analysisHeat transfer & fluid dynamicsThermal testingThermal FEA/CFD toolsCAD
Nice to have:System-level trade studiesProgramming for analysis

Benefits

  • Competitive benefits package including health, recovery, and related support (details in benefits section)
Last updated Sep 30, 2026. Interested? Apply on the company site.

About Anduril

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