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Product Quality Engineer, Advanced Manufacturing

Meta· Hardware Quality Engineering
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Hybrid (APAC)Full-timePosted 3w ago

About the role

Advanced Manufacturing Engineer, Product Quality to develop and implement manufacturing and quality processes for next-generation AI/ML & Networking hardware. Own SMT and PCBA assembly manufacturing technology roadmap, work with ODM ecosystem to enable high-volume production, and ensure packaging technologies are manufacturable at scale. Based in APAC office.

Responsibilities

  • Own and drive the Advanced manufacturing technology roadmap for SMT and PCBA assembly, translating Meta's multi-generation hardware direction into the process, equipment and materials capabilities required to build it
  • Partner with ODMs and EMS providers to develop and qualify new manufacturing capabilities ahead of product need — defining capability gaps, shaping joint development plans and equipment or process investments, and driving them from evaluation through production readiness
  • Collaborate with Meta's packaging technology team to ensure the manufacturing and assembly requirements of new advanced packaging technologies are understood and enabled at our manufacturing partners, representing assembly process capability, yield and reliability considerations into packaging technology decisions
  • Benchmark supplier and industry process capability, and influence internal design and technology roadmaps with a manufacturability point of view
  • Develop and implement manufacturing processes for Meta open hardware technologies, applying knowledge of product design, fabrication, assembly and testing
  • Lead SMT (Surface Mount Technology) process development for next-generation package and PCBA technologies in partnership with internal and external teams
  • Engage Meta engineering teams early to drive robust DFx requirements and ensure products meet cycle-time, cost, quality and yield targets
  • Serve as the technical authority for PCB and PCBA assembly process, materials and reliability within cross-functional project teams
  • Lead failure analysis on solder-joint and assembly defects using X-ray, CT, cross-section and dye-and-pry techniques

Qualifications

  • Bachelor's degree in Mechanical, Materials, Electrical, Chemical, Industrial/Manufacturing Engineering, or equivalent practical experience
  • Strong working knowledge of SMT process and PCB manufacturing processes
  • Excellent problem solving and communication skills
  • 8+ years experience in manufacturing of enterprise Hardware products
  • Knowledge of quality methodologies and tools is required
  • Some International travel may be required

Skills

Required:SMT process and PCB manufacturing processesDFx (design for excellence)Problem solving and communication
Nice to have:DS/DOEPackaging and interconnect technologiesDFx software (e.g., Valor NPI, Cadence Allegro)

Benefits

  • (Not specified in provided text)
Last updated Oct 23, 2026. Interested? Apply on the company site.

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