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Hardware Engineer, AI Accelerator Module Design

Meta· Data Engineering
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Menlo Park, CA$173k - $245kFull-timePosted 2w ago

About the role

Senior AI accelerator module design engineer responsible for end-to-end electrical and PCB design of accelerator modules supporting Meta's MTIA and third-party accelerators. Lead, define architectures and design standards, mentor engineers, and drive ODM/JDM programs from concept to mass production across multiple silicon generations.

Responsibilities

  • Own the end-to-end electrical architecture and PCB design of AI accelerator modules for high-performance, high-power, high-efficiency custom silicon (MTIA) and third-party accelerators
  • Define module requirements and specifications in partnership with ASIC, platform, rack, and systems architecture teams; translate system-level targets into implementable board-level design intent
  • Lead ASIC package-to-board co-design, including breakout routing strategy, substrate and interposer interaction, and escape feasibility analysis for high pin-count, high-bandwidth devices
  • Architect power delivery networks for extreme-current loads (multi-hundred-amp rails), owning DC-DC topology and architecture trade-offs (performance, transient response, efficiency, area, cost), decoupling strategy, and plane/stackup partitioning
  • Drive high-speed interface design across PCIe Gen5/Gen6, CXL, UCIe, DDR5/LPDDR, HBM, NVLink/scale-up fabrics, and Ethernet up to 800G, including simulation-guided stackup and channel budgeting
  • Set the technical direction for SI/PI methodology in partnership with Signal and Power Integrity teams; define correlation strategy between simulation and measured silicon
  • Define and own module-level design reviews; set the quality bar for schematic, layout, and DFM/DFT readiness across internal designs and ODM-executed designs
  • Lead board and silicon bring-up and own root-cause analysis of the most complex electrical, power, and interoperability failures; drive corrective design action to closure
  • Drive ODM/JDM partners through full NPI-to-mass-production cycles, holding partners to Meta design standards and schedule
  • Develop reusable reference designs, design-rule libraries, and design automation that scale across programs and generations; publish and champion designs through the Open Compute Project
  • Evaluate and qualify leading-edge technologies with industry partners — HDI and advanced substrates, embedded components, novel materials, co-packaged and coherent optics — and build the business case for adoption
  • Identify cross-organizational problems and lead XFN efforts to resolution without being asked; influence decisions outside your direct scope through technical credibility rather than authority
  • Mentor and develop PCB/module design engineers; contribute to hiring, calibration of technical standards, and team-wide best practices

Qualifications

  • BS in Electrical Engineering, Computer Engineering, or a related technical discipline
  • 10+ years of experience in electrical and PCB design for high-speed, high-power digital systems (servers, accelerators, networking, or HPC)
  • Demonstrated experience as the lead engineer taking multiple complex custom board or module designs from concept through volume production
  • Expert-level proficiency with EDA tools for schematic capture and PCB design (Cadence Allegro/OrCAD, Altium Designer, or equivalent)
  • Deep expertise in high-speed digital interface design (PCIe, CXL, DDR4/DDR5, HBM, Ethernet 25G–800G) and SerDes-based channel design, including stackup and channel budgeting trade-offs
  • Deep expertise in power delivery network architecture for high-current loads, including DC-DC topology selection, transient and efficiency analysis, and plane/decoupling strategy
  • Experience with ASIC or GPU package-to-board co-design and breakout routing for high pin-count devices
  • Experience leading board and silicon bring-up, debug, and failure analysis using oscilloscopes, VNAs, TDR, and power analyzers
  • Experience owning technical direction across multiple concurrent programs and influencing decisions across hardware, firmware, mechanical, thermal, and manufacturing organizations
  • Experience driving external ODM/JDM or component partners through design and production cycles
  • Experience communicating technical trade-offs and recommendations in writing and verbally to engineering leadership

Skills

Required:Electrical architecturePCB designPower delivery network designHigh-speed interfaces

Benefits

  • Benefits informational content linked in posting (refer to Meta benefits page)
  • Bonus
  • Equity
Last updated Oct 23, 2026. Interested? Apply on the company site.

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