Senior Hardware Manager, Co Package Optics Switch Design
NVIDIA· Mgmt, Hardware (Engineering)
Hybrid (Israel, Yokneam), Hybrid (Israel, Raanana)full-timePosted 7mo ago
About the role
Leader of the CPO switch Hardware Engineering team responsible for guiding a multi-disciplinary group to develop high-performance Co Package Optics switch systems from concept to mass production, within NVIDIA’s data center networking infrastructure focusing on AI-scale solutions.
Responsibilities
- - Build the best team to design and execute high-performance CPO (Co Package Optics) switch system from concept to mass production.
- - Be a key member of the technical leadership team developing world-class CPO switch designs.
- - Lead and support engineering teams in specification definition, electrical schematics, opto-mechanical design, component selection, layout guidance, lab testing, production processes, qualification workflows, micro-architecture development, verification, characterization, design for testability, cost optimization, reliability, and more.
- - Collaborate with and integrate all HW project disciplines: Board Design, Assembly Process, Mechanics, Thermal, PCB Layout, Process , Production Engineering, Software/Firmware, Procurement, NPI, and more.
- - Plan and oversee team’s work on multiple simultaneous development projects in coordination with the broader leadership team. Manage direct reports, set goals, provide coaching, conduct performance appraisals, plan careers, and make compensation recommendations.
- - Collect, examine, and filter requirements from internal customers to assemble a comprehensive plan of record for next-generation switches while planning resource allocation and assigning team members.
- - Schedule projects, create realistic outcome estimates, and drive timely execution for high-volume manufacturing.
Qualifications
- - A Bachelor's or Master's degree in Electrical Engineering.
- - 12+ overall years of industry experience in architecture, design, and methodology for cutting-edge board design development.
- - 6+ years of technical design management experience.
- - Proven experience in leading multi-disciplinary projects, multi-layer, high density PCB design.
- - A deep understanding of broadband high-speed ICs.
- - Ability to provide insight on trade-offs between power, performance, manufacturability, thermals, cost to meet product requirements.
- - Proven experience with leading execution of highly complex and innovative designs in tight schedules with risk mitigations and detailed planning for first-time success.
- - Strong interpersonal and communication skills, with the ability to quickly build relationships, prioritize conflicting needs, and align teams effectively.
Skills
Required:Electrical engineeringHigh-speed PCB designProject/people management
Last updated Jul 3, 2026. Interested? Apply on the company site.
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