Senior Package Modeling Engineer
NVIDIA· Engineer, Package Development
Santa Clara, CA$124k - $195.5kFull-timePosted 6mo ago
About the role
Senior Package Modeling Engineer in NVIDIA's Advanced Technology Group (ATG) focused on finite element analysis, materials evaluation, and reliability for advanced semiconductor packaging developments.
Responsibilities
- Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
- Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
- Analyze material properties and their impact on package reliability.
- Establish modeling approaches and assumptions, interpret simulation results, and provide practical mentorship that influences package build, material selection, and manufacturing processes.
- Collaborate with cross-functional teams to ensure robust package builds.
- Document modeling methodologies and present findings to collaborators.
Qualifications
- MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
- 5+ years of FEA modeling/simulation experience.
- Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
- Knowledge of thermal-mechanical interactions and reliability failure modes.
- Familiarity with JEDEC reliability standards and accelerated life testing.
- Practical understanding of advanced semiconductor packaging architecture and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).
- Excellent problem-solving, analytical, and communication skills.
Skills
Required:Finite Element Analysis (FEA)Material properties analysisPackaging architecture knowledge
Benefits
- equity
- benefits (as available from NVIDIA benefits)
Last updated Sep 11, 2026. Interested? Apply on the company site.
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