← All roles

Senior Packaging Technical Engineer - Hardware

NVIDIA· Engineer, Sys Design
Apply on company site
Bengalurufull-timePosted 3mo ago

About the role

Senior Packaging Technical Engineer responsible for defining chip pad ring, substrate interconnect schemes, and leading the package layout design process, collaborating with cross-functional teams to deliver robust electrical packages for GPUs and AI hardware.

Responsibilities

  • Defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process
  • Collaborating with Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers
  • Defining a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package
  • Communicating effectively with various teams throughout the company

Qualifications

  • BSEE or equivalent experience
  • Minimum of 8+ years in board/system design; experience with package design preferred
  • Good understanding of transmission line theory, power delivery and signal integrity desired
  • Strong programming and scripting skills in Perl, Python, Tcl; Cadence Skill and Excel familiarity helpful
  • Enthusiastic and able to work with minimal supervision
  • Ability to solve complex technical problems

Skills

Required:Chip pad ring and substrate interconnect designPackage layout design
Nice to have:Transmission line theoryProgramming/scriptingCadence

Benefits

  • Competitive salaries
  • Generous benefits package
Last updated Jul 10, 2026. Interested? Apply on the company site.

About NVIDIA

World Leader in AI Computing

NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

AIautonomous vehiclesgaminggpugraphics cardhigh performance computingliquid-ai-recruiting-targetllm
Company profileWebsite

More open roles at NVIDIA