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Senior Failure Analysis Engineer

NVIDIA· Engr, Failure Analysis
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Santa Clara, CA$144k - $230kfull-timePosted 3mo ago

About the role

Senior Failure Analysis Engineer to perform Physical Failure Analysis (PFA) on advanced ICs, focusing on root-cause investigations and developing novel FA methodologies within NVIDIA’s Failure Analysis Lab.

Responsibilities

  • Pioneer Novel Methods: Design and implement cutting-edge methodologies to drive successful root-cause investigations on leading-edge silicon, advanced heterogeneous packaging technologies, and complex integrated systems.
  • Precision De-processing: Perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of integrated circuit (IC) devices across die, package, component, and board levels.
  • Nanoscale Analysis: Apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques for high-resolution electrical and physical diagnostics of IC chips.
  • Innovate Characterization Platforms: Develop novel characterization techniques and specialized analysis platforms for emerging chip structures with advanced silicon architectures and complex packaging schemes.
  • Optimize Workflows: Design and implement robust FA workflows to improve lab efficiency and ensure accurate, reproducible root-cause determination.
  • Lead Root-Cause Investigations: Head high-impact failure analysis investigations to isolate root causes of critical failures affecting yield, performance, and long-term reliability.
  • Support multi-functional Engineering: Provide precise physical characterization data to support DOE evaluations, design optimization, process node improvements, and critical customer FA requests.

Qualifications

  • Domain Expertise: Deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and advanced failure analysis methodologies.
  • Sample Preparation: Proficiency in precision IC device sample preparation for targeted defect localization and physical root-cause analysis.
  • Microscopy & Inspection: Hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM) and related analytical inspection techniques.
  • System-Level Analysis: Knowledge of physical and electrical failure analysis across die, package, component, and board levels.
  • Education & Experience: B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or closely related field (or equivalent) with 8+ years of hands-on industry experience.

Skills

Required:Semiconductor IC fabricationSample preparation (IC devices)Microscopy (Optical, SEM, TEM)

Benefits

  • equity
  • comprehensive benefits package
Last updated Jul 24, 2026. Interested? Apply on the company site.

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