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Senior Packaging Technical Engineer - Hardware

NVIDIA· Engineer, Sys Design
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Santa Clara, CA, Remote, Hybrid (Remote - US)$168k - $258.8k + equityfull-timePosted 2mo ago

About the role

Senior technical engineer focusing on silicon pad rings and package technology, collaborating across multiple engineering teams to define chip floor plan, pad ring, substrate, and electrical packaging, with a focus on robust electrical package design in NVIDIA's hardware ecosystem.

Responsibilities

  • Defining and implementing the chip pad ring, substrate interconnect scheme, and lead the package layout design process.
  • Collaborating with Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
  • Defining a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
  • Communicating effectively with various teams throughout the company.

Qualifications

  • BSEE or equivalent experience.
  • Minimum of 8+ years in board/system design. Experience with package design is preferred.
  • Good understanding of transmission line theory, power delivery and signal integrity is desired.
  • Programming and scripting skills in Perl, Python, Tcl desired; Cadence Skill and EXCEL familiarity are useful and a plus.
  • Hardworking and able to work with a minimum of supervision.
  • You seek to solve complex technical problems.

Skills

Required:Pad ring designPackage design
Nice to have:Transmission line theoryPower delivery and signal integrityProgramming/scripting

Benefits

  • Equity and benefits package.
  • Competitive salaries and comprehensive benefits package.
  • Information about benefits available at www.nvidiabenefits.com/
Last updated Oct 23, 2026. Interested? Apply on the company site.

About NVIDIA

World Leader in AI Computing

NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

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