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Senior System and Manufacturing CoDesign Architect - Power, Thermal and Packaging

NVIDIA· Engineer, ASIC
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US, CA, Santa Clara; US, OR, Hillsboro$196k - $310.5kFull-timePosted 2mo ago

About the role

Senior Co-Design Architect role focused on cross-domain optimization at the intersection of architecture, silicon, systems, and manufacturing to push power, thermal, and packaging limits of NVIDIA’s silicon while ensuring testability and manufacturability.

Responsibilities

  • Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do.

Qualifications

  • BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
  • 12+ years relevant experience
  • Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems
  • Proven ability to convert physical-limit trends into impact, measures and solutions
  • Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations

Skills

Required:Power deliveryThermal dissipationPackaging technology evaluationCross-domain coordination

Benefits

  • equity and benefits package as part of compensation
Last updated Sep 25, 2026. Interested? Apply on the company site.

About NVIDIA

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NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

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