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Senior Packaging Technical Engineer - Hardware

NVIDIA· Engineer, Sys Design
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Hybrid (Taiwan, Hsinchu)full-timePosted 2mo ago

About the role

Senior Packaging Technical Engineer responsible for defining chip pad ring, substrate interconnect schemes, and leading package layout design, collaborating with cross-functional teams to deliver robust electrical packaging for GPUs.

Responsibilities

  • Defining the chip pad ring, substrate interconnect scheme, and leading the package layout design process.
  • Collaborating with Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.
  • Defining a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.
  • Communicating effectively with various teams throughout the company.

Qualifications

  • BSEE or equivalent experience.
  • Minimum of 5+ years in board/system design. Experience with package design is preferred.
  • Good understanding of transmission line theory, power delivery and signal integrity is desired.
  • Strong programming and scripting skills in Perl, Python, Tcl desired, Cadence Skill and EXCEL familiarity are helpful.
  • Enthusiastic and able to work with a minimum of supervision.
  • You seek to solve complex technical problems.

Skills

Required:Chip pad ring designSubstrate interconnect schemePackage layout design
Nice to have:Transmission line theoryProgramming/scripting (Perl, Python, Tcl)Cadence

Benefits

  • Competitive salaries
  • Generous benefits package
Last updated Aug 14, 2026. Interested? Apply on the company site.

About NVIDIA

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NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

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