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Senior Director, Board Product Development Engineering

NVIDIA· Mgmt, Product Development
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Santa Clara, CA$332k - $500.3kFull-timePosted 2mo ago

About the role

Senior leadership role overseeing integration methods and end-to-end readiness for next-generation NVIDIA datacenter board products, coordinating cross-domain engineering across PCB, SMT/PCBA, and High-Speed Connector & Signal Integrity to optimize the chip-to-board stack from design through high-volume manufacturing.

Responsibilities

  • Design, implement, and institutionalize the integration readiness process for all next-generation datacenter board products — owning manufacturing and test readiness end to end so build starts land on schedule and at target yield.
  • Guide the functional teams in developing cross-boundary techniques before silicon and stackup freeze occurs. Focus on warpage-tolerant DFM and reflow for next-gen BGA pitch. Manage impedance and CTE control for high-speed stackups. Lock pad-map and fab methods at an early stage.
  • Build, lead, and develop a global Board PDE organization across three technical pillars — PCB & Fab, SMT/PCBA, and High-Speed Connector & Signal Integrity.
  • Set up integration oversight throughout the chip-to-board stack. Define entry and exit requirements at each domain boundary. Lead the gates to confirm one qualified domain is ready to pass to the next.
  • Collaborate with Operations Test Engineering and Signal Integrity to establish test coverage and manufacturing test flow requirements, applying that thoroughness to the tester and diagnostic boards.
  • Take charge of reliability and yield performance throughout the stack. Investigate excursions to identify root causes. Address DFx and alternate-component gaps with the factory planning and design teams.
  • Support manufacturing partners (CM/ODM/OSAT, substrate, and PCB fab) in producing world-class datacenter products. Serve as the senior chip-to-board representative across NVIDIA's Operations, Engineering, and Executive teams.

Qualifications

  • BS in Electrical Engineering, Materials Science, or a related technical field (or equivalent experience); MS or PhD is a plus.
  • 15+ overall years in product, manufacturing, or operations engineering for high-complexity electronics. 8+ years leading engineering teams and 5+ years leading leaders in a global, cross-matrixed organization.
  • Track record of taking complex board and system products from design through NPI to high-volume manufacturing, with ownership of schedule, yield, and quality outcomes.
  • Comprehensive technical knowledge covering chip-to-board stack: advanced packaging and flip-chip BGA, high-density/high-layer-count PCB fabrication, SMT and assembly process qualification, and board-level reliability.
  • Solid expertise in high-speed signal integrity and manufacturing testing — BERT, channel margining, test coverage, diagnostic and tester board development.
  • Demonstrated success building cross-functional processes and sign-off gates under schedule pressure, with credibility to influence domain owners without owning their qualification.
  • Experience collaborating with ODM/CM/OSAT and PCB fab suppliers to qualify new methods before production.
  • Excellent executive communication — ability to distill complex technical information into concise recommendations for technical and non-technical audiences.
  • Willingness to travel internationally (~20%), primarily to manufacturing partners in Asia.

Skills

Required:Integration readiness processCross-domain warpage-tolerant DFM and reflow for next-gen BGA pitchImpedance and CTE control for high-speed stackupsLeadership of global Board PDE organization

Benefits

  • equity
  • benefits package (see NVIDIA benefits)
Last updated Aug 21, 2026. Interested? Apply on the company site.

About NVIDIA

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NVIDIA invents the GPU and drives advances in AI, HPC, gaming, creative design, autonomous vehicles, and robotics.

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