Staff Signal Integrity Engineer
Google· Google
Haifa; Tel AvivFull-timePosted 1mo ago
About the role
Be part of a team developing custom silicon solutions powering Google's direct-to-consumer products. Lead end-to-end signal integrity efforts for complex multi-die packages and collaborate across silicon design, packaging, and external partners.
Responsibilities
- Lead end-to-end signal integrity definition, channel budgeting, and stackup optimization for complex multi-die packages (including 2.5D, 3D stacking, high-density substrates).
- Architect and optimize multi-terabit interconnects across Die-to-Die, host links, and memory subsystems in collaboration with PHY and silicon design teams.
- Build high-accuracy 3D full-wave electromagnetic models for micro-bumps, C4 bumps, TSVs, interposers, and BGA transitions with automated flows for statistical eye/BER margin analysis.
- Define high-frequency test vehicles, fixtures, and measurement methodologies; execute multi-port VNA, TDR, and real-time scope characterizations to correlate lab measurements with simulations.
- Collaborate with Silicon Design, Package Layout, Board/System, and external foundry/OSAT partners to resolve design trade-offs
Qualifications
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field, or equivalent practical experience.
- 10 years of experience in Signal Integrity (SI), Power Integrity (PI), or high-speed hardware packaging.
- Experience in electrical channel modeling, jitter budgeting, and return loss/crosstalk optimization for high-speed interfaces (PCIe Gen5/6, SerDes PAM4, DDR5, Die-to-Die interconnects).
- Experience with lab measurement equipment including multi-port VNA, TDR, and high-bandwidth real-time oscilloscopes for correlation with simulations.
Skills
Required:Signal Integrity (SI)Power Integrity (PI)Electrical channel modelingJitter budgeting3D/2.5D packaging
Last updated Oct 23, 2026. Interested? Apply on the company site.
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