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Sr. Mechanical Engineer

Amazon· Annapurna Labs (U.S.) Inc. - Artificial Intelligence Hardware
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Hybrid (Cupertino, CA)$183k - $247.6kFull-timePosted 1mo ago

About the role

Senior Mechanical/Thermal Engineer responsible for end-to-end thermal and mechanical architecture for ML/AI accelerator platforms, from concept to production and fleet operations, within Annapurna Labs/ AWS.

Responsibilities

  • Own the complete thermal and mechanical design for ML/AI accelerator platforms — from rack-level infrastructure down to chip packaging, including mechanical packaging, structural integrity, and interconnect systems
  • Define thermal and mechanical design requirements, establish design targets, and drive cross-functional alignment across hardware, firmware, and software teams
  • Deliver production platforms through the full lifecycle: concept, design, analysis, prototyping, validation, manufacturing ramp, and fleet operations
  • Design and optimize cooling solutions (air and liquid) for high-power-density ML/AI accelerators
  • Develop detailed CFD models, compact RC models, and structural FEA for SoC/package thermal analysis and mechanical integrity
  • Design rack manifolds, cold plates, and data center liquid cooling interfaces for at-scale liquid-cooled deployments
  • Develop and validate mechanical structures including chassis and enclosures for manufacturability, reliability, and serviceability (tolerance stack-up analysis, GD&T, DFM)
  • Own mechanical design of integrating high-speed interconnect subsystems including cable cartridges, backplane connectors, and mating interfaces — defining alignment, gatherability, insertion force, and serviceability requirements
  • Perform structural FEA for shock, vibration, and transportation loads to ensure mechanical integrity
  • Participate in on-call rotations monitoring fleet thermal telemetry for emergent issues
  • Perform root cause analysis of thermal and mechanical failures in production, implementing firmware updates, hardware modifications, or operational procedure changes
  • Drive design standardization and engage with ODMs and component suppliers to drive design optimization, cost reduction, and supply chain resilience
  • Lead design reviews, mentor junior engineers, and contribute to the technical direction of the broader organization
  • Influence chip packaging decisions and establish validation methodologies

Qualifications

  • BS degree in mechanical engineering or equivalent
  • 7+ years industry experience in Mechanical and Thermal design in electronics packaging
  • 3+ years of experience in SoC Thermal modelling and IC package transient thermal response
  • Experience with chip package, system mechanical & thermal design for air-cooled and liquid-cooled systems
  • Experience with tolerance analysis (stack-up/GD&T) and sheet metal or precision-machined component design for electronics packaging
  • Experience with production fleet support: telemetry analysis, root cause analysis, and defining mitigation strategies
  • Experience leading cross-functional technical projects spanning silicon, firmware, mechanical, and operations teams

Skills

Required:Thermal designMechanical designCFD modellingFEAGD&T3D CAD

Benefits

  • Health insurance (medical, dental, vision, prescription) and life insurance options
  • 401(k) matching
  • Paid time off
  • Parental leave
  • Disability and mental health support
  • Adoption and Surrogacy Reimbursement coverage
  • Flexible Spending Accounts
  • Employee assistance programs
Last updated Oct 25, 2026. Interested? Apply on the company site.

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