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Senior Design Automation Engineer

Amazon· Hardware
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Austin, TX$185.2k - $250kFull-timePosted 4w ago

About the role

Senior Design Automation Engineer to contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs, developing automation and workflows across Package and PCB design from floor planning to tape-out and manufacturing release.

Responsibilities

  • Develop and deploy efficient design methodologies to support Package and PCB layout tasks across the design cycle: die floor planning, bump/pad assignment, RDL routing, substrate design, verification, and tape out release.
  • Evaluate industry EDA offerings and make recommendations for purchase and usage of advanced packaging features to design 2.5D interposer, 3D-IC, fan-out wafer-level packaging, and silicon bridge technologies (e.g., CoWoS, EMIB, or similar).
  • Deliver custom design automation to improve RDL and substrate routing for high-density interconnects including microbumps, C4 bumps, TSVs, microvias, and PTH vias across multi-layer organic substrates or silicon interposers.
  • Contribute to cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels under guidance from senior engineers.
  • Develop data integration flows for co-design data across Package, PCB and SI/PI flows.
  • Develop software in the following languages: Python, Skill, TCL. Utilize AI coding agents to speed development and iteration.
  • Identify preferred methodologies to integrate physical verification checks (DRC, connectivity, shorts/opens) into physical design cycles.
  • Follow and help refine package design rules and guidelines, working with OSAT partners and foundries to ensure DFM compliance.
  • Collaborate with SI/PI engineers to incorporate electrical constraints into the physical layout methodologies — impedance-controlled routing, power plane optimization, and critical net shielding.

Qualifications

  • Bachelor's degree in Computer Science, Computer Engineering, or Electrical Engineering
  • 7+ years of experience working with physical design tools across Package and PCB domains: Allegro, APD, 3DICC, Expedition
  • 10+ years of Automation experience for physical designs
  • Master's degree or Ph.D. degree in Electrical Engineering or related field (preferred)

Skills

Required:Package and PCB physical design automationAutomation for physical designs

Benefits

  • Health insurance (medical, dental, vision, prescription) and Life & AD&D insurance
  • EAP, Mental Health Support
  • Flexible Spending Accounts
  • Adoption and Surrogacy Reimbursement coverage
  • 401(k) matching
  • Paid time off
  • Parental leave
Last updated Oct 25, 2026. Interested? Apply on the company site.

About Amazon

Amazon.com, Inc. or its affiliates

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