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Fabrication Backend Process Engineer, Quantum AI

Google· Google Quantum AI
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Goleta, CA, USA$108k - $153kFull-timePosted 3w ago

About the role

Role focused on development and manufacturing of quantum processor devices, owning die singulation, die cleaning, hybridization, and device characterization modules, and developing scalable bonding and packaging processes to meet quality standards.

Responsibilities

  • Partner closely with design, test, frontend, packaging teams to integrate new backend modules into devices and refine device probing, packaging, and measurement methodologies
  • Lead the sustainment and development of die singulation, die preparation, device hybridization modules and device characterization
  • Operate and maintain equipment to ensure optimal outcomes and minimize downtime
  • Design, build, and maintain backend process infrastructure; implement standardized work practices and optimize workflows
  • Analyze process data to identify trends, improve stability, and drive continuous yield improvement

Qualifications

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or related field, or equivalent practical experience
  • 1 year of experience in a wafer level or die level cleanroom environment
  • 1 year of experience with SPC, Electrical test, Metrologies, or Failure analysis
  • 1 year of experience in hybridization techniques, including flip chip bonding, die handling and post bonding measurement

Skills

Required:Die singulationDie preparationDevice hybridizationDevice characterizationProcess engineering
Nice to have:Data analysis

Benefits

  • Learn more about benefits at Google (implicit in description)
Last updated Oct 23, 2026. Interested? Apply on the company site.

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