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Senior Hardware Technical Lead, Interconnect Systems

NVIDIA· Engineer, ASIC
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Yokneam, Israelfull-timePosted 2w ago

About the role

Senior individual contributor with leadership focus responsible for end-to-end technical program execution of complex Co-Packaged Optics (CPO) and Silicon Photonics (SiPho) interconnect hardware from concept to mass production, coordinating across multiple engineering groups and driving on-time delivery of aerospace-grade interconnect solutions.

Responsibilities

  • Drive the full program lifecycle of advanced CPO and interconnect test solutions — from requirements through architecture, design, bring-up, characterization, qualification, and release to HVM (high-volume manufacturing)
  • Act as the technical focal point across parallel workstreams including Board Design, Silicon Photonics, Opto-Mechanics, Thermal, FW/SW, DFT, Process Engineering, Manufacturing, and Quality
  • Mentor engineers, conduct design reviews, and deliver constructive feedback to elevate team capabilities
  • Consolidate requirements from internal stakeholders into a comprehensive plan of record; coordinate resource allocation and team assignments
  • Define and execute the validation and coverage strategy from die to system level; develop characterization plans, test methodologies, automation frameworks, and data analysis pipelines
  • Perform hands-on electrical and optical debugging, failure analysis, and failure segmentation; drive root-cause analysis across multiple domains
  • Develop scripting and automation solutions (Python) for test automation, data collection, hardware control, and production optimization
  • Partner with manufacturing and production engineering teams to build robust test solutions for mass production and improve yield and test coverage

Qualifications

  • B.Sc. or M.Sc. in Electrical Engineering, Electro-Optics, Applied Physics, or related field (or equivalent experience)
  • 12+ years in hardware system engineering, characterization, and/or product engineering for electro-optical or high-speed communication products
  • 5+ years as a technical lead across multi-disciplinary projects end-to-end
  • Proven technical program management experience from concept through mass production
  • Hands-on hardware design, lab bring-up, characterization, debug, and electrical specification review
  • Proficiency in Python scripting, data analysis (JMP or equivalent), test automation, and hardware control interfaces (I2C, SPI, JTAG)
  • Strong communication and interpersonal skills with ability to influence senior stakeholders and global teams
  • Self-driven ownership mindset; able to solve end-to-end problems in fast-paced, multi-project environments

Skills

Required:Python scriptingData analysisI2CSPIJTAG

Benefits

  • Not specified in the description
Last updated Oct 9, 2026. Interested? Apply on the company site.

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