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Advanced Packaging Development Engineer, Quantum AI

Google
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Goleta, CA, USA$159k - $230kFull-timePosted 2w ago

About the role

Advanced Packaging Engineer focused on emerging packaging technologies for scaling superconducting quantum processors and related components within Google Quantum AI.

Responsibilities

  • Design, architect, and implement novel packaging platforms.
  • Investigate and characterize electrical, thermal, and mechanical properties of packaging materials.
  • Develop and document new process flows and Design-For-Integration (DfI) principles for emerging technologies.
  • Lead technical engagements with external vendors and partners to evaluate, co-develop, and qualify next-generation packaging processes and components outside of the current standard manufacturing processes.
  • Conduct root cause analysis and develop mitigation strategies for performance-limiting factors (e.g., yield, reliability, signal integrity) unique to those new technologies.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field (e.g., Optics, Sensors, Audio/DSP, etc.), or equivalent practical experience.
  • 5 years of experience in 3 of the following areas of packaging development: simulation, layout and design, process engineering, assembly, test and measurement, failure analysis.
  • 5 years of experience with one or more of the following technologies: 2.5D/3D integration, wafer level packaging, panel level packaging, bump bonding.
  • 3 years of experience delivering R&D concepts to a released product.
  • 3 years of experience developing advanced packaging solutions.

Skills

Required:Packaging designElectrical, thermal, and mechanical characterizationDesign-For-Integration (DfI)
Nice to have:Vendor program management
Last updated Oct 23, 2026. Interested? Apply on the company site.

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