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Technical Lead, Hardware/Software Codesign, TPU Inference

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Sunnyvale, CA, USA$240k - $333kFull-timePosted 1w ago

About the role

Technical Lead responsible for shaping TPU hardware/software codesign and driver architecture, bridging AI research with next-generation hardware to accelerate ML training and inference.

Responsibilities

  • Define and drive the technical roadmap and architecture for the hardware/software stack, ensuring unparalleled performance for the training and serving of large ML models.
  • Act as the technical liaison between advanced research, software, and hardware teams, steering model architecture innovation to maximize scaling, quality, and hardware efficiency.
  • Architect and oversee the development of next-generation configurable simulation frameworks and cycle-accurate performance models, setting the standard for how the organization evaluates complex micro-architectural decisions.
  • Advocate system-level performance analysis across highly distributed ML systems, innovating new methodologies to balance compute, memory bandwidth, and inter-chip network requirements.
  • Manage cross-functional partnerships across hardware engineering, compiler development, and ML research to influence broad organizational strategy and transition paradigm-shifting concepts into production.

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, a related field, or equivalent practical experience.
  • 12 years of experience in computer architecture, chip architecture, or hardware-software co-design.
  • Experience developing systems for performance modeling, simulation, or system analysis.

Skills

Required:Electrical EngineeringComputer ArchitecturePerformance Modeling/Simulation
Last updated Oct 23, 2026. Interested? Apply on the company site.

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