Senior Package Layout Engineer - Hardware
NVIDIA· Engineer, Mask Design
Full-timePosted 4d ago
About the role
Senior Package Layout Engineer responsible for designing and developing sophisticated IC substrate layouts for NVIDIA products, collaborating with Technical Package Lead and design teams to plan schedules, resolve costs, manufacturing, and electrical design issues.
Responsibilities
- Collaborate to implement high speed/density ASIC packages.
- Perform substrate breakout patterns for ASIC packages.
- Optimize package pinout incorporating system level trade-offs of pins assignment.
- Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
- Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
- Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
- Develop symbols and CAD library databases using Cadence APD design tools.
- Develop methodologies to improve layout productivity.
Qualifications
- Hold a B.S. Electrical Engineering or equivalent experience
- 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
- Proven experience in substrate layout of wire bond and flip chip packages, preferred
- Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
- Solid understanding of high-speed design signal integrity practices
- Experience with Virtuoso and Calibre is a plus
- Experience using Valor is helpful
Skills
Required:PCB layout
Last updated Oct 23, 2026. Interested? Apply on the company site.
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