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Hardware Reliability Intern, PhD, Summer 2027

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Hybrid (Taipei)InternshipPosted 3d ago

About the role

Paid 10-12 week hardware engineering internship for PhD students in Taiwan focused on hardware reliability, system/subsystem boards for server and storage products, with opportunities to develop modeling, validation, and collaboration across teams.

Responsibilities

  • Responsibilities may vary based on specific teams.
  • Synthesize findings to accelerate BGA rework process optimization, supporting ML ramp expansion and ensuring hardware product reliability.
  • Develop localized PCB warpage modeling and identify options for optimizing the simulation meshing process.
  • Work with Google platform teams and cross-functional teams on new technology and solutions.

Qualifications

  • Currently pursuing a PhD degree in Reliability Engineering, Mechanical Engineering, Materials Science, Electrical Engineering, or a related technical field.

Skills

Required:PCB modeling
Nice to have:Thermomechanical modelingData analysis / 3D modeling / mechanical simulation toolsAnsys (APDL, Workbench, Icepak)Test, validation, and materials characterization tools
Last updated Oct 23, 2026. Interested? Apply on the company site.

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