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Senior HW Material Engineer

Amazon· Hardware Development
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Hybrid (Haifa, ISR)full-timePosted yesterday

About the role

Senior Material Engineer responsible for materials engineering across Nitro card development (PCB materials, laminate systems, mechanical/thermal materials) at Annapurna Labs, AWS. Lead experimental work, define test/qualification methodologies, and coordinate with cross-functional teams and suppliers to balance performance, reliability, and supply continuity for Nitro cards (K2).

Responsibilities

  • Own PCB material strategy for K2 cards: selection, qualification, and stackup design
  • Challenge PCB construction defaults with manufacturability risk assessment
  • Guide design teams on material selection for signal integrity and thermal requirements
  • Lead material characterization experiments; own data analysis and decision outputs
  • Introduce new PCB materials, balancing performance gains against qualification and supply chain risk
  • Select and qualify TIMs, adhesives, encapsulants, and underfills for Nitro card assemblies
  • Design vapor chamber and liquid cooling solutions for high-performance hardware
  • Evaluate material performance under temperature cycling, vibration, and humidity conditions
  • Define reliability test plans and own qualification data packages for NPI
  • Develop and socialize design rules, test methodologies, and manufacturing best practices
  • Serve as materials engineering authority in design reviews, NPI gating, and supplier discussions
  • Monitor EOL notifications, evaluate alternatives, and qualify drop-in replacements
  • Mentor engineers, contribute to hiring, and raise the technical bar

Qualifications

  • 8+ years of direct experience in materials engineering for hardware products, encompassing PCB materials, laminate technologies, air and/or liquid cooling design aspects, and electronic assembly manufacturing processes
  • B.Sc. or higher in Materials Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or related field
  • Deep expertise in PCB laminate systems: high-speed/low-loss dielectric materials, hybrid stackup design, trade-offs between material classes for high-performance electronic assemblies
  • Experience with high scale product manufacturing and working with remote vendors
  • Strong analytical skills: ability to design experiments (DOE), analyze data rigorously, and draw actionable conclusions

Skills

Required:PCB material selection and stackup designMaterial characterization and data analysisReliability testing and qualification
Nice to have:Thermal management design (TIMs, adhesives, encapsulants, underfills)Cross-functional leadershipDOE and experimentation
Last updated Oct 25, 2026. Interested? Apply on the company site.

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