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Senior/Principal Optical Packaging Engineer

Microsoft· Research Sciences
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Cambridge, United Kingdom£74.7k - £122.6kFull-timePosted 1mo ago

About the role

Principal Optical Packaging Engineer responsible for package architecture and assembly strategy for emerging optical interconnect and co-packaged optics technologies, translating system-level requirements into scalable packaging solutions across research, engineering, and product teams.

Responsibilities

  • Shape next-generation optical and advanced packaging technologies for AI infrastructure and high-performance computing.
  • Work at the intersection of optics, photonics, semiconductor packaging, silicon, networking, and AI system design.
  • Influence package architectures integrating photonic devices, electronic ICs, ASICs/chiplets, interposers, optical interfaces, and thermal solutions.
  • Collaborate across research, engineering, sourcing, manufacturing, and product teams, as well as with industry partners.
  • Help move technologies across the complete lifecycle, from architecture and prototype development through supplier qualification and production readiness.
  • Translate advanced research and packaging innovation into scalable technologies with real-world product impact.

Qualifications

  • Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Optical Engineering, Physics, or a related technical field, or equivalent practical experience.
  • 5+ years of industry experience in advanced semiconductor packaging, optical/photonics packaging, heterogeneous integration, electronic packaging, or related hardware technologies.
  • Experience in advanced packaging and assembly in areas such as 2.5D/3D integration, interposers/RDL, fine-pitch interconnects, die attach/bonding, underfill, moulding, adhesives, and thermal management.
  • Experience integrating optical/photonics devices with electronic ICs and package structures, with understanding of optical coupling/alignments, electrical interconnects, thermal/mechanical behaviour, package reliability, and manufacturability.
  • Hands-on experience in package development and productisation lifecycle stages including process characterisation, design validation, reliability qualification, failure analysis, DFM, and manufacturing readiness.
  • Experience working with external manufacturing or technology partners (foundries, OSATs, optical component/module suppliers, equipment suppliers, or material suppliers) including technical assessments or manufacturing-readiness reviews.

Skills

Required:Package architecture and system-level requirements translationOptical/photonics integration2.5D/3D integration and interposer technologyThermal management and mechanical reliabilityLifecycle management from prototype to productionVendor and partner collaboration

Benefits

  • This description references company-wide benefits but does not enumerate them here; benefits are typically available to eligible employees.
Last updated Sep 24, 2026. Interested? Apply on the company site.

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