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Principal Package Engineer

Microsoft· Silicon Engineering
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Redmond, WA, Mountain View, CA, Austin, TX, Raleigh, NC, Hillsboro, OR$142.8k - $274.8kFull-timePosted 1w ago

About the role

Microsoft SCHIE seeks a Principal Package Engineer to lead advanced packaging technology selection, qualification, and manufacturing for Azure datacenter hardware, driving 2.5D/3D packaging, supplier management, and test vehicle development across silicon, package, and system performance.

Responsibilities

  • Drive optimal silicon packaging solution supporting Azure datacenter product roadmap.
  • Drive package technology for chiplet architecture with advanced 2.5D/3D packaging.
  • Drive 2.5D/3D packaging product designs (bridge/interposer/substrate) from definition, development to tapeout
  • Define, design and develop test vehicles to validate Silicon, Package, System performance.
  • Drive supplier assessments and manage suppliers through definition, development, qualification and production.
  • Develop and deliver FMEA (Failure Mode and Effects Analysis) for various technology options.
  • Define EDA tools requirements for advanced 3DIC packaging designs
  • Design and develop package and assembly drawings to support the manufacturing.
  • Lead supplier assessments and manage suppliers through definition, development, qualification and production.
  • Assess and characterize the reliability of Integrated Circuits (IC) packages.
  • Design and develop package and assembly drawings to support the manufacturing.
  • Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
  • Drive execution of architecture solutions across product lines or multiple product groups and across teams that account for design trends and future concepts by leveraging cross-functional expertise, industry best practices, and lessons learned from teams working across multiple product lines.
  • Drive engineering system design decisions that require collaboration between internal and external stakeholders to account for platform-specific technology decisions and develop system models based on current and anticipated feature/design needs and trade-offs.

Qualifications

  • Doctorate in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience OR Master’s Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Bachelor’s Degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR equivalent experience.

Skills

Required:Advanced 2.5D/3D packagingTest vehicle design and developmentFMEAEDA tools requirements for 3DICSupplier managementSystem-level packaging integration
Last updated Oct 16, 2026. Interested? Apply on the company site.

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