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Senior Packaging Engineer

Microsoft· Silicon Manufacturing and Product Engineering (SMPE)
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Hybrid (Malaysia, Pulau Pinang, Gelugor)Full-timePosted 1w ago

About the role

Senior Packaging Engineer to support silicon packaging manufacturing operations, quality, and reliability within Microsoft's SCHIE, CSME, and SMPE teams. Responsible for end-to-end packaging development, qualification, supplier engagement (OSATs), and manufacturing readiness from development through high-volume production.

Responsibilities

  • Package Development & Production Ramp - Drive package development and manufacturing readiness from engineering builds through qualification and production ramp.
  • Define and maintain package manufacturing specifications, process requirements, control limits, and readiness criteria.
  • Lead OSAT technical engagement, including process reviews, development checkpoints, manufacturing readiness assessments, and technical audits.
  • Monitor manufacturing and test-vehicle data to identify package/process risks and accelerate learning during development.
  • Drive structured ramp management, ensuring package technology, process capability, yield, quality, and capacity are ready for volume production.
  • High-Volume Manufacturing & Sustaining - Provide technical oversight of OSAT and supplier performance across package assembly and related manufacturing processes.
  • Monitor package yield, process health, quality indicators, and manufacturing excursions.
  • Lead technical root-cause analysis and corrective/preventive actions for package-related yield, quality, and reliability issues.
  • Drive excursion prevention, containment, disposition, and continuous improvement with suppliers and cross-functional teams.
  • Support product change management, including technical assessment and risk evaluation of manufacturing changes.
  • Establish supplier and OSAT technical checklists, audit criteria, and ongoing manufacturing health reviews.
  • Quality & Supplier Management - Drive package quality assurance in partnership with supplier quality and manufacturing teams.
  • Conduct regular supplier technical reviews, onsite assessments, process audits, and technology-development engagements.
  • Ensure supplier manufacturing processes meet product quality, reliability, yield, and production requirements.
  • Identify gaps in OSAT capability and drive closure plans ahead of production ramp.

Qualifications

  • BS/MS/PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Packaging Engineering, or a related technical discipline.
  • Significant industry experience in semiconductor packaging, assembly, process engineering, package development, or manufacturing.
  • Demonstrated experience taking advanced package technologies from development through qualification and high-volume production.
  • Strong experience working directly with OSATs and external manufacturing partners.
  • Demonstrated ability to solve complex package/process/yield/reliability issues using structured technical analysis.
  • Strong communication skills with the ability to influence suppliers and cross-functional engineering organizations.
  • Expertise in: Advanced semiconductor packaging technologies and manufacturing processes; Package architecture and design fundamentals; Assembly technologies, materials, process integration, and manufacturing controls; OSAT manufacturing and supplier technical management; Package design-for-manufacturing and design-for-reliability; Product introduction, qualifications, production ramp, and high-volume manufacturing; Yield analysis, process capability, excursion management, root-cause analysis, and corrective actions; Package reliability and failure mechanisms; Cross-functional technical leadership across silicon, package, test, quality, manufacturing, and system teams.

Skills

Required:Packaging technology & manufacturingOSAT management
Last updated Oct 16, 2026. Interested? Apply on the company site.

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