Senior Printed Circuit Board (PCB) Designer
Microsoft· Hardware Engineering
Redmond, Mountain View, Santa Barbara$119.8k - $234.7kOn-sitePosted 1w ago
About the role
Senior PCB Designer sought to translate engineering requirements into manufacturable PCB designs for quantum hardware, collaborating across electrical, mechanical, manufacturing, and verification teams from design through release and verification.
Responsibilities
- Own complex Printed Circuit Board (PCB) layout from engineering requirements through design release, including component placement, signal routing, power distribution, layer stack-up, controlled impedance, and high-density interconnect design.
- Partner closely with electrical, mechanical, manufacturing, and other engineering disciplines to translate schematics and system requirements into robust, manufacturable PCB designs.
- Develop and maintain PCB layouts using Electronic Computer-Aided Design (ECAD) tools such as Cadence Allegro, applying appropriate design constraints, routing practices, and library content throughout the design.
- Perform and support PCB design reviews, including Design Rule Check (DRC) closure, stack-up and material review, mechanical clearance verification, controlled-impedance requirements, and documentation of design-specific requirements.
- Collaborate with PCB fabrication and assembly suppliers to address Design for Manufacturability (DFM) requirements, incorporate fabrication feedback, and produce complete manufacturing release packages.
- Improve PCB design methodologies, libraries, workflows, and automation to increase design quality, consistency, reuse, efficiency, and scalability across hardware-development programs.
Qualifications
- Bachelor's Degree in Electrical Engineering, Computer Engineering, or related field AND 5+ years technical engineering experience
- OR Master's Degree in Electrical Engineering, Computer Engineering, or related field AND 3+ years technical engineering experience OR equivalent experience.
Skills
Required:PCB layoutECAD tooling (Cadence Allegro)Design for Manufacturability (DFM)Cross-disciplinary collaboration
Nice to have:Signal integrity / power integrityCryogenic / low-noise / RF environments
Last updated Oct 16, 2026. Interested? Apply on the company site.
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